EMBEDDED MICROSTRIP LINE TO STRIPLINE VERTICAL TRANSITION USING LTCC TECHNIQUE

Beeresha R S, A M Khan, Manjunath Reddy H V, Ravi S

Abstract: The low-temperature co-fired ceramic (LTCC) design technology is a present trend in high frequency application designs. The behavior of passive RF/microwave frequency components needs to be investigated to understand transition effect of a signal in a multilayer circuit. The aim of this paper is to design low-loss unlike-media transition model of microstrip to stripline in multilayer circuits. The transition models were designed using different conducting materials like silver, gold and copper, also for simulation studies an ideal reference model known as ‘perfect conductor’ (PEC) is used. The selected transition bandwidth is in the range 1GHz to 30GHz. The analysis of the transition effect is done with the help of scattering parameters. The perfect conductor is a reference conductor for studying transition losses. The electromagnetic (EM) simulated results of the perfect conductor obtained using NI/AWR EDA environment is compared with silver and copper conductor material models. The observed results of silver and copper conductor models lies very close to the results obtained using PEC (perfect) conductor model. From the studies done we conclude that the design & simulation of ultra-wide band transition microstrip line to stripline(1GHz to 30GHz) is possible with good in insertion loss & return loss.

Keywords: NI/AWR, Copper conducting material, EM Simulation, LTCC, Microstrip line, PEC (perfect) conductor, Silver conducting material, Stripline, System on Chip, Transition

DOI: https://doi.org/10.15623/ijret.2015.0424005