THERMAL ANALYSIS OF CPU WITH VARIABLE BASEPLATE HEAT-SINK USING CFD

Channamallikarjun

Abstract: The computational fluid dynamics is concentrated on the forced air cooling of the CPU using a heat sink. This paper utilizes CFD to identify a cooling solution for a desktop computer, which uses an 80 W CPU maximum whereas this number will be increased in the range of 70-120W in the forthcoming desktop computer systems. This paper considers the optimal plate fin heat sink design and cylindrical fin heat sink design with variable copper base plate and the control of CPU heat sink processes. To have a better heat dispersion performance, a computational fluid dynamics is utilized to search for an optimal set of plate-fin. Base plate thickness, fin thickness, fin profile and fin material parameters are to be handled together due to the frequently encountered space limitations. The different heat sink designs are analyzed by using commercial CFD software packages ANSYS design modeler for modeling and ANSYS meshing for CFD meshing and finally ANSYS fluent is used for CFD solver. The well converged; results are compared with the experimental data. Especially, replacing aluminum with copper as base plate material improved the performance. This study will benefit the design engineers involved in electronic cooling and also help to reduce the significant increases in the sound power emitted by the CPU

Keywords: HEATSINK

DOI: https://doi.org/10.15623/ijret.2014.0315096