EXPERIMENTAL & NUMERICAL STUDY OF FORCED CONVECTION LAMINAR FLOW THROUGH COPPER MICRO CHANNEL HEATSINK

S.Subramanian, K.S.Sridhar, C.K.Umesh

Abstract: A rectangular micro channels having 500 microns width & 1500 microns depth have been machined out of Oxygen free high conductivity Copper material on an area of 12.5mm X25mm. De-ionized water was used as a coolant. The thermal & fluid flow performances have been tested for the flow velocities ranging from 0.5m/s to 1.2m/s. Micro channels performances have been numerically simulated using commercially available computational fluid dynamics software ANSYS CFX. The simulated results have been validated with the experimental results and published literature. The effects of Temperature dependent material properties on simulation have been examined.

Keywords: Metallic micro channels, Single phase laminar flow cooling, Thermal performance of micro channels, Electronics cooling

DOI: https://doi.org/10.15623/ijret.2014.0312014